The ZB1520HL Reflow Oven is a critical piece of equipment in the surface mount technology (SMT) assembly process used for soldering surface mount components to printed circuit boards (PCBs). It consist of multiple heating zones, typically three to six or more, each with its own temperature control. This allows precise control over the thermal profile, which includes ramp-up rates, peak temperatures, and cool-down rates. These zones are used to heat the PCB and solder paste to specific temperatures. ZB1520HL Reflow Oven is available in various sizes and configurations to accommodate different PCB sizes and production volumes.